Amaoe Qu-3 Stencil for Qualcomm Cpu
Original price was: ₹400.00.₹139.00Current price is: ₹139.00.
* Material: Japanese steel sheet
* Sternness: Super hard
* Hole type: Square
* Re-usable: Yes
* Thickness: 0.12MM
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Amaoe Qu-3 Stencil for Qualcomm Cpu
Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.
Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component’s pads with precision.
Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.
Aperture Design: The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.
Stencil Material: Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.
What is the Amaoe QU-3 Stencil?
The Amaoe QU-3 Stencil is a 0.12 mm thick alloy-steel BGA (Ball Grid Array) reballing/rework stencil. It’s designed to assist technicians in the accurate placement of solder balls (or solder paste) onto the pads of Qualcomm processors during repair and reassembly
Which Qualcomm CPUs Are Compatible?
This stencil supports a range of Qualcomm CPU models, including:
MSM7225A
MSM8928A / B
MSM8940
MSM8952
MSM8909
MSM8612
SDM660
These are often found in various smartphones from manufacturers like Xiaomi, Huawei, Oppo, Vivo, and more.
What Is It Used For?
Reballing: When a Qualcomm BGA CPU has issues—such as damaged solder joints—technicians remove the chip, clean off old solder, and then reattach it by accurately placing solder balls using the stencil.
Precision Soldering: The stencil ensures solder paste or balls align precisely with the CPU’s pads, enabling even heat distribution and optimal electrical connections.
This process is essential for CPU-level repairs in mobile devices, ensuring devices stay functional and reliable after repair
Why Use the Amaoe QU-3 Stencil?
| Feature | Benefit |
|---|---|
| 0.12 mm precision | Enables accurate solder placement |
| Alloy-steel build | Durable and reusable for multiple repair cycles |
| Targeted compatibility | Tailored for specific Qualcomm CPUs, reducing fit issues |
Frequently Asked Questions (FAQ)
1. What is an Amaoe stencil used for?
An Amaoe stencil is used for BGA reballing and rework in electronics repair. It helps technicians accurately position solder balls or solder paste on CPU, GPU, or IC pads—commonly for smartphones, tablets, and other devices.
2. Which CPUs are compatible with the Amaoe QU-3 stencil?
The Amaoe QU-3 stencil is compatible with several Qualcomm CPUs, including:
MSM7225A
MSM8928A / MSM8928B
MSM8940
MSM8952
MSM8909
MSM8612
SDM660
3. What thickness is the Amaoe QU-3 stencil?
It is 0.12 mm thick, which ensures high precision while maintaining durability for multiple repair cycles.
4. Is the Amaoe stencil reusable?
Yes. Made from high-quality alloy steel, Amaoe stencils are reusable if handled properly. Avoid excessive bending or scratching to prolong their lifespan.
5. Do I need special tools to use an Amaoe stencil?
Yes. Commonly used tools include:
Hot air rework station or reflow machine
Solder balls or paste
Flux for better adhesion
PCB holder or fixture for stability
Cleaning tools (e.g., solder wick, isopropyl alcohol)
6. How do I clean the stencil after use?
After reballing, remove excess solder or paste using isopropyl alcohol (IPA) and a lint-free cloth. Avoid harsh scrubbing to maintain the stencil’s precision.
7. Can I use one stencil for different CPUs?
Some stencils support multiple chip models, but using the correct stencil for the specific CPU ensures better alignment and fewer errors.
10. Is using a stencil necessary for CPU repair?
Yes. Without a stencil, manually placing solder balls on tiny BGA pads is extremely difficult and prone to errors. A stencil ensures accuracy, speed, and reliability.
Amaoe Qu-3 Stencil for Qualcomm Cpu
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