Amaoe MP-2 Stencil for Qul/mt/pm Power
What Is the Amaoe MP‑2 Stencil?
The Amaoe MP‑2 (also sometimes styled as PM/MT power IC stencil) is a 0.12 mm stainless steel BGA reballing stencil designed for precise solder pad patterns of power management ICs (PMICs) used in Qualcomm and MediaTek platforms.
Compatible Power ICs
Supports a wide range of IC models, including:
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Qualcomm PM8450, PM8350 (incl. BH, C variants), PM7325, PM7325B, PM7350C
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PM7250, PM7250B
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PM6350, PM4250, PM6225
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MediaTek MT6365 (VMW/MP/RP), MT6359 VPP, MT6635XP, MT6225, MP6335WP
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Other related PMIC models in the Qualcomm/MTK ecosystem
Primary Use-Cases
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Reballing or reflowing power ICs in smartphone boards (especially modern Qualcomm/MediaTek architectures).
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Repairing PMIC failures or replacing components that provide voltage regulation and power distribution.
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Ensuring precise solder deposition for ultra-fine pitch ICs—critical for preventing shorts or cold joints.
Amaoe MP-2 Stencil Key Features
| Specification | Details |
|---|---|
| Material | Stainless steel |
| Thickness | ~0.12 mm |
| Pattern | Square-hole BGA layout |
| Compatibility | Wide PMIC support for Qualcomm & MediaTek |
| Typically Sold As | Single stencil (~USD 1.8–2.2) |
Stencil Purpose: Amaoe MP-2 Stencil are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.
Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component’s pads with precision.
Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.
Aperture Design: The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.
Stencil Material: Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.
