Amaoe Qu-2 Stencil for Qualcomm CPU

What it’s used for

1. Precise solder paste application

The Amaoe Qu-2 Stencil for Qualcomm CPU is used to accurately deposit solder paste onto the exact solder pad layout of the CPU. With a thickness of about 0.12 mm, it ensures reliable alignment for solder balls within tight pitch tolerances typical of BGA chips.

2. CPU repair and reballing

In mobile phone motherboard repair—especially when removing or replacing a damaged Snapdragon CPU—technicians use this stencil to reball (reapply solder balls) before reflowing the chip back onto the board. This restores electrical connections and functionality.

3. Improved consistency in professional repair workflows

Because it is made of high‑quality stainless steel and is re‑usable, the Amaoe QU‑2 stencil enables consistent alignment and solder ball size during multiple reballing operations, reducing variability and mistakes.

Compatible Qualcomm CPU Models

Here are some example Qualcomm chipsets compatible with the QU‑2 stencil:

• MSM8953 (variants such as B01, 1AB)

• MSM8937

• MSM8998 series (A and B packages)

• MSM8916
  These are commonly found in mid-range smartphones from brands like Xiaomi, Huawei, Oppo, Vivo, etc.

Features:

Stencil Purpose: Stencils are used to precisely apply solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.

Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component’s pads with precision.

Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.

Aperture Design: The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.

Stencil Material: Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.

SUPPORTED MODEL:-

• MSM8953 B01
• MSM8953 1AB
• MSM8937
• MSM8916
• MSM8998 B
• MSM8998 A

Amaoe Qu-2 Stencil for Qualcomm CPU

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