Amaoe SWT-1 Stencil

What is Amaoe SWT‑1?

The Amaoe SWT-1 Stencil is a 0.12 mm stainless steel BGA reballing stencil tailored for smartwatch, POS device, and ultra‑compact board repair.

Target Components & Compatibility

The SWT‑1 variant is specially made for tiny ICs found on smartwatches and similar devices. Compatible chips include:

• Qualcomm PM8916 power IC

• MSM8909W CPU / RAM (in large and small pad variants)

• SC2721G SoC

• SL8521E

• BCM47755, WRT2965, SR3593A, WCN3610, FS1896 wireless chips.

Primary Use-Cases

• Reballing micro BGA ICs: Precisely deposit solder paste or balls onto fine-pitch pads of smartwatch chips.

• Repair tiny device motherboards: Perform CPU, RAM, or RF IC replacements or reflow in wearables or POS units.

• Prevent misalignment and solder bridging thanks to the stencil’s accurate hole positioning.

How It Works: Basic Steps

1. Remove the target IC (e.g. service chip) from its board.

2. Clean both the IC underside and board pads.

3. Align the SWT‑1 stencil over the IC so that holes map exactly to pad layout.

4. Spread solder paste or load solder balls through the stencil.

5. Carefully remove the stencil.

6. Reflow the IC using hot air or infrared.

7. Reinstall the IC onto the device board.

Amaoe SWT-1 Stencil

Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.

Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component’s pads with precision.

Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.

Aperture Design: The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.

Stencil Material: Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.

Amaoe SWT-1 Stencil

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