Relife High-effect Adhesive Remover Liquid

Key Features and Specifications

• Primary Use: Softens and removes tough glues (phenolic aldehyde, epoxy, acrylic, polyurethane, and silicone resin sealants) around BGA IC chips and motherboards without damaging the circuit boards or components.
• Form: Liquid, typically sold in a 20 ml bottle.
• Safety: Marketed as an eco-friendly, non-flammable solution with low toxicity. It is a weak acid and should be used with caution, avoiding skin and eye contact.
• User Experience: Reviewers and product descriptions indicate it is effective, easy to apply with a pipette, and leaves a residue-free surface after washing. 

Usage Instructions

According to product information from Abest and other retailers, use of the RL-039 involves the following steps: 

1. Shake well before use.
2. Apply a proper amount of the solution carefully with a pipette onto the sealant that needs to be removed.
3. Wait for 5-10 minutes (or up to 20 minutes according to some sources) to allow the sealant to soften. Place the mainboard and BGA IC horizontally during this time.
4. Carefully peel off the softened sealant using a specialized tool, paying attention to the surrounding wiring.
5. Wash off any residual adhesive and solution from the chip mainboard after removal.